Thinfilm Electronics (Thinfilm) has announced it will receive US$350,000 in funding through the FlexTech Alliance to create smart labels featuring next-generation sensors and Near Field Communications (NFC) capabilities.
Through the project, Thinfilm plans to extend the scope and versatility of its proprietary technology and smart label platform, while maintaining alignment with established processes for high-volume label manufacturing.
The thin, flexible smart labels produced by Thinfilm as a result of this project will incorporate one or more sensors that dynamically detect, measure, and report on a range of environmental phenomena.
Michael Ciesinski, FlexTech Alliance President and CEO, said, "FlexTech is excited about the advancements this important project will bring about in smart labels and their dynamic sensing functionality." Michael added, "We’re pleased to award this funding to a leader in the printed electronics industry and look forward to working closely with Thinfilm over the coming months."
Erwan Le Roy, Senior Vice President & General Manager, Smart Sensors, for Thinfilm, said, "Our project with FlexTech is a significant step in creating the foundation for a next-generation sensor label capable of supporting a number of critical applications." Erwan added, "FlexTech Alliance has been at the forefront in advancing flexible electronics from R&D to commercialization. We look forward to our work together over the next year, which will further strengthen our relationship and advance Thinfilm’s mission of making everyday objects smart."