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Thursday, 23 Nov 2017

UK project to print low cost energy harvesting device for use in NFC applications

The project brings together a strong consortium with varied and complementary expertise in printing of electronics, logic circuitry, applications testing and final device integration

3 Sep 2015 | Editor

The Centre for Process Innovation (CPI) has announced a UK-based consortium to develop a novel printed energy harvesting device that is powered by near-field communication (NFC). The device aims to facilitate the wider adoption of NFC-enabled applications in consumer packaging, document and brand security, in addition to wireless sensor networks for defence, healthcare and medical devices.

The aim of the project is to develop and scale up production of the energy harvesting device which is suitable for integration with sensors, displays and storage devices.

CPI/HaRFest/Pragmatic Printing - Concepts for bottle temperature

Figure: CPI/HaRFest/Pragmatic Printing - Concepts for bottle temperature

The device will house a printed antenna alongside printed passive and active components, including an array of tuning capacitors. The device will be able to be tuned to resonant frequency and thus maximise the harvested power output.

CPI/HaRFest/Pragmatic Printing - Concepts for bank notes

Figure: CPI/HaRFest/Pragmatic Printing - Concepts for bank notes

The 18 month Innovate UK project titled HaRFest is being led by PragmatIC and involves CPI alongside the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics, represented by its academic partners University of Cambridge and the Welsh Centre for Printing and Coating (Swansea University).

Sandy Gunn, Business Development Manager at CPI, said, The project brings together a strong consortium with varied and complementary expertise in printing of electronics, logic circuitry, applications testing and final device integration. The challenge ahead is to develop the energy harvesting technology which is proven at laboratory scale and to move it towards the volumes and price points that facilitate mass market adoption. Once concluded the project will spearhead the uptake of battery-free radio frequency powered systems into intelligent packaging, anti-counterfeiting and other fast moving consumer goods products."
Richard Price, Chief Operating Officer at PragmatIC, said, "HaRFest addresses a wide range of potentially high volume applications identified by PragmatIC’s customers, and we look forward to moving these into commercial production."
Luigi Occhipinti, National Outreach Manager of the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics, said, "We are delighted to be working with innovative companies such as PragmatIC and CPI. The collaboration offers our academics a unique opportunity to test their ideas and research outputs, assess and mature the corresponding technology readiness level up to TRL3 or more and, from there, start the journey towards industrial scale up."

New opportunities are opening up to integrate high volume, low cost printed sensors into everyday products

With applications present in a number of market sectors, the Internet of Things and NFC are increasingly gathering attention from businesses, technology providers and most importantly the modern day consumer. NFC allows consumers to intuitively communicate with everyday items such as product packaging. The printing of electronic functionality has enabled designers to embed technology into their designs, creating innovative components that are low cost, smarter, lightweight and wireless.

Applications are numerous, from interactive point-of-sale products and branding to disposable printed bio-sensors used in blood analysis and unobtrusive printed smart labels that allow for identification and anti-counterfeiting control.

The integration of advanced printed sensors into packaging opens up a wide range of market opportunities to create products with added value. Sensors can be designed to indicate the validity or quality of a product or whether the packaging has been subject to tampering or excursions during its transport and storage prior to purchase.

Source: CPI

www.pragmaticprinting.com    www.uk-cpi.com    www-large-area-electronics.eng.cam.ac.uk   


About Centre for Process Innovation (CPI)

The Centre for Process Innovation is a UK-based technology innovation centre and part of the High Value Manufacturing Catapult. We use applied knowledge in science and engineering combined with state of the art development facilities to enable our clients to develop, prove, prototype and scale up the next generation of products and processes.

Our open innovation model enables clients to develop products and prove processes with minimal risk. We provide assets and expertise so our customers can demonstrate the process before investing substantial amounts of money in capital equipment and training. New products and processes can be shown to be feasible; on paper, in the lab and in the plant before being manufactured at an industrial scale.

By utilising our proven assets and expertise companies can take their products and processes to market faster. There is no down time in production as all of the process development is completed offsite and our technology transfer and engineering teams can help companies to transfer the product or process into full scale production at speed.

Source: Centre for Process Innovation (CPI)

About EPSRC Centre for Innovative Manufacturing in Large

The EPSRC Centre for Innovative Manufacturing in Large-Area Electronics is a partnership between four UK academic Centres of Excellence in Large-Area-Electronics (LAE) at the University of Cambridge (Cambridge Innovation and Knowledge Centre, CIKC), Imperial College London (Centre for Plastic Electronics, CPE), Swansea University (Welsh Centre for Printing and Coating, WCPC) and the University of Manchester (Organic Materials Innovation Centre, OMIC.

The EPSRC Centre was created to work with industry to address key manufacturing research challenges enabling us to meet end-user needs for multifunctional large-area electronic systems that include sensors, power generation and storage, signal processing and logic elements, and output capability through information display or by wireless transmission.

Source: EPSRC Centre for Innovative Manufacturing in Large


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