OSA-Direct
Thursday, 23 Nov 2017

Aixtron acquires OLED encapsulation company PlasmaSi

Aixtron believes thin-film encapsulation is an essential process for OLED high volume manufacturing, and want to add significant value in the production of OLED applications

8 Apr 2015 | Editor

Aixtron believes thin-film encapsulation is an essential process for OLED high volume manufacturing, want to add significant value in the production of OLED applications

Aixtron has announced that it has acquired PlasmaSi, Inc the transaction took place with with effective on the 1 April 2015. PlasmaSi is privately held and based in Silicon Valley.

According to the announcement PlasmaSi had developed a proprietary process technology for the encapsulation of organic thin-films by depositing ultra-thin and flexible barrier films which is considered to be applicable for a range of products most notably - OLED display and OLED lighting products.

While not specifically disclosing a minimum payment for the acquisition Aixtron did publish that the purchase price "may" reach up to US$16 million, and is to be paid in cash. [Editors notes: it is assumed that the maximum purchase price will be based on meeting and/or exceeding agreed development and sales milestones.]

According to information supplied by Aixtron:

  • PlasmaSi was established in Fremont (USA) in 2009
  • PlasmaSi has three granted patents and ten patents for their technology
  • PlasmaSi has R&D demos at several leading panel manufacturers

PlasmaSi initially designed and targeted OLED applications , but their technology is expected to find opportunities in organic electronics, organic photovoltaic and related applications as well as address opportunities in applications that require thin-film encapsulation.

Aixtron is expected to integrate PlasmaSi’s thin-film encapsulation process into its existing OLED cluster for customer demonstration purposes.

Martin Goetzeler, President and CEO of Aixtron, said, "While increasingly expanding our business focus towards OLED in the coming years, we were looking to broaden our technology portfolio as well as to strengthen our customer access by adding PlasmaSi to our product portfolio." Martin added, "Thin-film encapsulation is an essential process step for OLED high volume manufacturing, specifically for flexible devices. In combining our OVPD technology with PlasmaSi’s innovative approach, we will be able to add significant value in the production of flexible OLED applications."
Adam Kablanian, CEO and Chairman of the Board of PlasmaSi, said, "We are delighted that we have found a strong partner in Aixtron, a company that has an impressive track record in the successful commercialization of deposition technologies in the semiconductor equipment industry. Therefore, joining forces with Aixtron is the best option for us and we are now looking forward to take our technology to the next level together. Thereby, we will strongly benefit from Aixtron’s R&D and production capabilities as well as from its worldwide sales, service and support network."

www.aixtron.com   


About Aixtron

Source: Aixtron


login

cintelliq logo